粤公网安备 44011302004783号 heterogeneous
投放时间: 2025-01-07 08:00:00
This white paper highlights the technical challenges from a system-level packaging perspective as advanced heterogeneous integrated packages are assembled on the board. The salient trends and challenges are addressed from design, materials, assembly processes, reliability, and metrology points of view.
搜索关键词 heterogeneous integrated packages, semiconductor packaging, advanced packaging, system level packaging, assembly processes, reliability metrology, design materials, technical white paper, integrated circuit packaging, electronic components优势 Highlights technical challenges,System-level packaging perspective,Addresses design, materials, assembly, reliability, and metrology
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38217
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3161
最新发现时间
2025-01-07 08:00:00
投放天数
210
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主页名字IPC
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