新媒网 · 跨境数据社区

Scarica il White Paper e scopri come migliorare la retention del tuo eCommerce grazie ai dati di prima parte.

This white paper highlights the technical challenges from a system-level packaging perspective as advanced heterogeneous integrated packages are assembled on the board. The salient trends and challenges are addressed from design, materials, assembly processes, reliability, and metrology points of view.