COMPUTEX 2025: Powerchip & Ecosystem 3D AI Semiconductor Solutions

【COMPUTEX 2025 Exhibitor Spotlight｜Powerchip】 🚀 Powerchip (PSMC) is joining forces with 10 ecosystem partners to unveil a dedicated 3D AI Semiconductor Solutions Zone at #COMPUTEX2025! 🔹 Show Info: 📍 Location: TaiNEX 1 📅 Dates: May 20–23, 2025 📌 Booth: I1111, TaiNEX 1 Experience cutting-edge AI innovations from: Etron: Showcasing VHMTM memory stack solutions for AI/HPC, including 3D Interposer integration for optimized bandwidth and efficiency. ESMT: Presenting next-gen aiPIM architecture, enabling in-memory computing with DRAM-logic integration for edge AI acceleration. Zentel Japan: Introducing RD-LE-HBM, a high-bandwidth, low-power memory for edge AI and IoT systems. ITRI & PSMC: Unveiling the jointly developed MOSAIC 3D AI chip, combining logic and memory layers to reduce power, latency, and cost. iCatch (智成): Demonstrating ARM-based 3D WoW IC design and one-stop turnkey SoC solutions for edge AI. DeepMentor: Showcasing AI IP optimized for LLMs and multimodal generation, enhancing model training and deployment efficiency. Skymizer: Presenting HyperThought AI accelerator IP supporting agentic workflows and multimodal inference in embedded and automotive devices. AEMemory: Exhibiting DDR5 PMICs, SPD HUB, and micro display driver backplane technologies built on PowerIGZO. Don’t miss Taiwan’s strength in next-gen AI semiconductors! 🔗 Full news: https://www.twiota.org/en/eventDetails.aspx?id=31b14e9f-cc00-4faf-b568-f562ad7f1a8f 📝 Register for entry: https://www.computex.biz/ #COMPUTEXTAIPEI #3DAI #SemiconductorInnovation #EdgeAI #PSMC #TechEcosystem #SmartTech #TaiwanTechPower #InnovationShowcase ------- 【COMPUTEX 2025 展商亮點｜Powerchip 力積電】 🔹 力積電十強聯手 共同打造3D AI半導體創新專區 在全球科技業高度關注生成式AI與高效能運算技術的浪潮下，COMPUTEX 2025特別匯聚台灣半導體供應鏈的堅強陣容，由力積電領軍，聯合愛普科技、晶豪科技、工研院、智成電子、Skymizer、滿拓科技、Zentel Japan、力晶微元等十家重要夥伴，於本屆展會推出「3D AI半導體解決方案專區」，展現台灣在AI晶片與3D封裝整合領域的世界級實力。 🔹 展出亮點技術包括： 3D堆疊與封裝整合：力積電展示Wafer-on-Wafer晶圓堆疊及Interposer方案，展現高頻寬與低功耗優勢。 高頻寬記憶體創新：愛普VHMTM系列提供高容量多層堆疊記憶體模組，滿足AI與HPC應用需求。 本地AI推論平台：晶豪aiPIM技術以低延遲、低功耗打造普及型AI運算模組。 邊緣AI專用記憶體：Zentel RD-LE-HBM實現高帶寬與低能耗兼具。 系統級整合應用：工研院MOSAIC 3D AI晶片創新運算與儲存結構，顯著提升效能與效率。 SoC加速與設計服務：Skymizer HyperThought AI IP、智成3D WoW IC設計服務與滿拓針對LLM最佳化的AI解決方案，支援多樣化場景。 🔹 展覽資訊： 📍 地點：台北南港展覽館一館 📅 展期：2025年5月20日至23日 📌 攤位號碼：I1111 COMPUTEX主辦單位表示，本次3D AI半導體解決方案的聯合展出不僅突顯台灣在全球AI與半導體供應鏈的關鍵地位，也將協助全球業者尋找高效、低功耗、具市場潛力的AI晶片技術，開啟次世代智慧應用的新局。 — 🔗 完整新聞內容： https://www.twiota.org/eventDetails.aspx?id=031b8500-6a9b-483c-9268-448226afd380 🔗 展覽入場登錄： https://www.computex.biz/ 📢 #COMPUTEX2025 #AI半導體 #3D封裝 #生成式AI #台灣半導體 #智慧運算 #邊緣AI #TechInnovation