Chipbond Engineering Talents Hiring Event

投放时间: 2025-07-01 08:00:00

Engineering Talents Wanted! Ready to start your career with the world’s leading Outsourced Semiconductor Assembly and Test (OSAT) Company from Taiwan? Seize the opportunity to join our exclusive hiring event in Batu Kawan, Penang. >> https://global.cake.me/chipbond-fb 📍 Venue: Batu Kawan, Penang 📅 Date: 26 July 2025 (Saturday) 🕘 Time: 2 PM - 6 PM (Registration starts at 1:30 PM) Job Opportunities : Engineers of Bumping / Process / Equipment / Product / Production / Information Technology / Automation / QA Competitive package: Monthly salary starting at RM5,000 📍 About Chipbond Founded in 1997 and headquartered in Hsinchu, Taiwan, Chipbond Technology Corporation is a prominent provider of semiconductor backed services, specializing in IC bumping, Wafer testing, Wafer-level packaging (WLP), IC assembly and final testing. 🔥 The form will be closed on 15 July, Register NOW >> https://global.cake.me/chipbond-fb

搜索关键词 semiconductor engineering jobs, Malaysia hiring event, Chipbond careers, Penang job fair, OSAT company, Engineering Talents, Bumping Engineer, Process Engineer, Equipment Engineer, Automation Engineer优势 Opportunity to work for a leading OSAT company.,Competitive salary starting at RM5,000.,Chance to join an exclusive hiring event.

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