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** 2.1 epoxy art resin** Art resin-2.1 Art resin- 2.1 can be cured under normal temperature and low temperature, with the feature of high transparency, low viscosity. Application Art resin-02 can be widely used for drops of glue, handmade jewelry, underwater lamp potting and mold filling, casting, electronic components potting etc.. Properties before Hardening Part A B Color Transparent Transparent Specific gravity 1.15 0.96 Viscosity (25℃) 800-2500CPS 100 MAXCPS Mixing ratio A: B = 2:1(weight ratio) Hardening conditions 25 ℃×12H to 24H or 80℃×2H (2 g) Usable time 25℃×40min (100g) Operation 1.Weigh A and B glue according to the given weight ratio into the prepared cleaned container, fully mixed the mixture again the container wall by clockwise, place it along for 3 to 5 minutes, and then it can be used. 2.Take the glue according to the usable time and dosage of mixture to avoid wasting. When the temperature is below 15 ℃, please heat A glue to 30 ℃ first and then mix it to the B glue (A glue will be thicken in low temperature ); The glue must be sealed lid after use to avoid rejection caused by moisture absorption. 3.When the relative humidity is higher than 85%, the surface of the cured mixture will absorb moisture in the air, and form a layer of white mist in the surface, so when the relative humidity is higher than 85%, is not suitable for room temperature curing, suggest to use the heat curing. Properties after Hardening Hardness, shore D 75 Withstand voltage, KV/mm 22 Flexuralstrength, Kg/mm2 28 Volume resistivity, Ohm3 1x1015 Surface resistance, Ohmm2 5X1015 Thermal conductivity, W/M.K 1.36 Induced electric loss, 1KHZ 0.42